SMT Hybrid Packaging
International Exhibition & Conference for System Integration in Micro Electronics.
From 16 to 18 May 2017 in Nuremberg
(Hall 4A, Booth 320).
The SMT Hybrid Packaging is the only event in Europe that provides a holistic approach to system integration in microelectronics. It shows all technical processes that the production of electronic modules involves: from the idea and development through to the manufacture.
Experience the entire spectrum of surface-mount and packaging technologies.
The international trade fair together with the parallel conference sees itself as a meeting place for all areas of electronics manufacture, a platform for showcasing new developments and as an important driver for the entire manufacturing process within microelectronics.
Technologies and Processes | Materials and Components | Manufacture Manufacturing Equipment | Reliability and Test | Software and Systems | Service and Advice
Visit us – this year in Hall 4A Booth 320!
Christian Koenen Team
for a free visit to the SMT Hybrid Packaging 2017