Welcome on the info page for the SMT Hybrid Packaging Exhibition

SMT Hybrid Packaging
International Exhibition & Conference for System Integration in Micro Electronics.
From 16 to 18 May 2017 in Nuremberg
(Hall 4A, Booth 320).

 

 

The SMT Hybrid Packaging is the only event in Europe that provides a holistic approach to system integration in microelectronics. It shows all technical processes that the production of electronic modules involves: from the idea and development through to the manufacture.

Experience the entire spectrum of surface-mount and packaging technologies.

The international trade fair together with the parallel conference sees itself as a meeting place for all areas of electronics manufacture, a platform for showcasing new developments and as an important driver for the entire manufacturing process within microelectronics.

Thematic focuses:
Technologies and Processes | Materials and Components | Manufacture Manufacturing Equipment | Reliability and Test | Software and Systems | Service and Advice

Visit us – this year in Hall 4A Booth 320!

 

Your

Christian Koenen Team

Your voucher

for a free visit to the SMT Hybrid Packaging 2017

  1. Please redeem your voucher HERE and you will receive your free entrance ticket to the SMT in Nuremberg
  2. Register by indicating your online registration number
    Retrieve KOENEN GmbH online registration number
    Retrieve Christian Koenen GmbH online registration number
  3. Your free personalised entrance ticket valid during the entire exhibition period will be sent to you by e-mail

Do you wish to make a personal appointment?

We will be happy to reserve a personal appointment with one of our contacts for you.

© 2017 Christian Koenen GmbH